Versatile USB 3.0 to FIFO interface bridge chip suitable for a range of applications
05-01-2016 |
Farnell element14
|
Semiconductors
FTDI's FT60x series SuperSpeed USB3.0, a USB 3.0 to FIFO interface bridge
chip, is now available from Farnell element14. The versatile device is
suitable for a range of applications including industrial imaging, digital
camera and video camera interface and upgrading legacy peripherals to USB.
Features include :
1 - Support for USB3.0 SuperSpeed (5Gbps), USB High Speed (480Mbps) and USB
2.0 Full Speed (12Mbps) transfer.
2 - Available with either 16bit / 32bit wide parallel FIFO interface.
3 - Supports 2 parallel slave FIFO bus protocols, with data bursting rate up
to 400Mbps.
4 - Supports multi-channel FIFO interface.
5 - Up to 8 configurable endpoints (pipes).