Versatile family of robust high-density 1.27mm wire-to-board headers
04-02-2016 |
TTI Europe
|
Connectors, Switches & EMECH
TTI Europe now stocks Molex Picoflex headers. The versatile, robust family
of high-density 1.27mm wire-to-board headers and connectors, now with
reverse PCB footprint SMT headers, offer space-saving solutions for a
greater range of compact power and signal ribbon-cable applications.
By Electropages
Electropages is a trusted source of news and insights from the global electronics industry. With a dedicated team of experts and editors, Electropages delivers in-depth articles, product updates, and market trends across sectors such as embedded systems, IoT, connectors, and power solutions. Our mission is to empower engineers and professionals with the knowledge they need to innovate and succeed in a rapidly evolving technological landscape.
