Fast-cure conductive adhesive for small to medium size chip bonding
15-09-2016 |
EMS
|
Design & Manufacture
Engineered Materials Systems (EMS) has unveiled its new EMS 561-338 fast-cure conductive adhesive for die attach applications with small to medium size die. The product is designed to cure in less than one minute at 150C.
The adhesive is stress-absorbing to withstand the rigours of thermal cycling and features high conductive stability. The material can be applied by stencil printing or needle dispensing.
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