New SiP device easier for designers to quickly create production-ready systems

Mouser now stocks the OSD3358 system-in-package (SiP) from Octavo Systems. The SiP device makes it easier for designers to quickly create production-ready systems based on the Texas Instruments (TI) Sitara AM3358 processor with an ARM Cortex-A8 core. The device is geared to help developers who are using the BeagleBone Black Wireless single board computing platform (or any design based on Sitara processors) move from prototype to production effortlessly. The SiP simplifies the design of application-specific mainboards based on the Sitara AM3358 processor. The device integrates the core of the BeagleBone Black — the AM3358 processor, the TI TPS65217C power management IC (PMIC), the TI TL5209 low dropout (LDO) voltage regulator, 512mb of DDR3 SDRAM, and over 140 passive components — into a single BGA package. Through this integration, the OSD3358 removes the complexities of power sequencing and DDR-to-processor interfacing that are typical in the design process. At the same time, the single package simplifies the supply chain and facilitates lower-cost manufacturing. The device is fully compatible with the BeagleBone Black Wireless, designed for powerful IoT applications. Developers can prototype software on the BeagleBone Black Wireless and then seamlessly transition it to custom boards that include the SiP without loss of performance.