Temperature elements suitable for a wide range of applications

Now available through TTI Europe is a series of TDK NTC temperature elements for a wide range of applications. The design is covering NTC elements with standard lead spacing, minisensor NTCs with flexible wires, glass encapsulated NTC elements for temperatures up to 300C, as well as leadless NTC chips for bonding - sintering/soldering technology. The standard families have been qualified according to automotive standard AEC Q200. The series of temperature elements features the chip NTC S860 with resistance values R(25C) between 5kohm up to 100kohm and a chip geometry from 0.45mm up to 1.7mm. Lead NTCs incorporate glass encapsulated NTCs for a temperature range between -55C up to 300C and resistance values R(25C) from 2kohm up to 230kohm. The G1540 device benefits from an extremely short response time. Glass encapsulated NTC elements are also available insulated upon request. For temperatures up to 155C, epoxy coated minisensors or leaded NTCs with lead spacing (epoxy or lacquer coated up to 125C) are available. Minisensors are indicated by bendable wires, resistance values R(25C) between 2kohm and 100kohm, short response time and include versions with insulated lead wires. Leaded NTCs with lead spacing are available with a wide range of resistance values R(25C) of 1kohm up to 470kohm. The components are cost effective solutions for many industrial segments and are suitable for taping for automated mounting.