Interconnect system in compact form increases port density and speed

Molex has expanded its Nano-Pitch I/O interconnect system portfolio with the addition of 8X cables and XD (eXtra Durable) vertical board mounted connectors. Delivering data speed rates of 25Gbps per lane, the system offers industry-leading port density and multi-protocol support to internal storage, server and mobile/enterprise applications. The XD board receptacles are offered as both 4X and 8X and use four through-hole pins for maximum robustness. “Customers need simple solutions to download data to storage systems across a multitude of protocols,” said Bob Wagner, group product manager, Molex. “The Nano-Pitch 8X Interconnect System meets industry’s rising data transfer needs with increased port density and speed to solve space and performance issues well into the future.” Storage systems applications for the system include data centre and enterprise storage systems, storage racks, JBODs, storage controllers, HBA servers and RAIDS. Telecommunications/networking applications for the connector include hubs, servers, switches and routers.