Effectively test wetting balance of component leads with the new dip wetting tester

Seika Machinery has introduced the MALCOM SWB-2 Dip Wetting Tester. The system effectively tests the wetting balance of component leads and eliminates irregularities during testing with a fully automated wetting test procedure. The tester automates the entire procedure, from flux application (with flux temperature control function) to measurement end. The system reduces unstable measurement results and user error. With the device, users can easily change solder and flux as needed, while efficiently analyzing data with the exclusive PC software. As an added option, a cover allows for wetting evaluation in an N2 environment. The device complies with the wetting test method according to JIS Z3198 (Lead-Free Solder Test Method) standards.