High-speed backplane connector system features new DMO options

Samtec has expanded their ExaMAX High-Speed Backplane Connector System with new DMO options. System designers can now leverage the inherent advantages of direct mate orthogonal architectures when compared with traditional backplane systems. The company’s new ExaMAX DMO solutions offer system designers flexibility by removing the mid-plane, allowing fabric cards and line cards to mate directly. This fast-growing system architecture increases airflow and improves thermal efficiencies throughout the chassis. DMO solutions enhance signal integrity via shorter trace lengths and less connector transitions while streamlining the system BOM and optimizing system cost. The system consists of the new EBDM-RA series which mates directly with existing EBTF-RA series. Currently both six pair x 10 column and six pair x 12 column solutions are available. Guide pin and screw mount options are also available. Six pair x six column and six pair x eight column options are under development. "Next generation system designers are quickly adopting DMO architectures," said Jonathan Sprigler, Backplane product manager at Samtec, Inc. "Leading equipment vendors from across the data center industry - storage, server, networking and other applications – are leveraging the advantages of DMO via Samtec’s new EBDM-RA series."