Adhesive specially designed for bonding SMDs on to circuit boards

10-11-2017 | Techsil | Subs & Systems

Techsil has launched a new fast curing epoxy adhesive Structalit 5610 from manufacturers Panacol. This adhesive is specially designed for bonding SMDs on to circuit boards. Due to its high viscosity the adhesive is well-suited for screen printing. The red-coloured epoxy adhesive makes a perfect contrast to green circuit boards. The one-component adhesive is easily applied via dispenser, screen printing or needle transfer. The SMD adhesive cures thermally within minutes, even at low temperatures. At the same time it is highly temperature-resistant. It can be temporarily exposed to temperatures up to 280C, making it the perfect adhesive for reflow soldering. Once cured, the adhesive is extremely shock-resistant and features very high adhesion to FR4 circuit boards, to metals and to epoxy-based mould materials.
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