New technology enables next-generation augmented reality head-up displays

Texas Instruments has unveiled the next evolution of DLP technology for in-vehicle head-up display (HUD) systems. The new DLP3030-Q1 chipset, along with supporting EVMs, gives automakers and Tier-1 suppliers the ability to bring bright, dynamic AR displays to windshields and place critical information within the driver’s line of sight. Designers can take advantage of the automotive-qualified chipset to develop AR HUD systems that project VIDs of 7.5m and greater. This is made possible by the unique architecture of the technology that enables HUD systems to withstand the intense solar loads created when projecting long VIDs. The combination of increased VIDs and ability to showcase imagery across a wide FOV gives designers the flexibility to create AR HUD systems with enhanced picture depth for an interactive, not distractive infotainment and cluster system.