New UFS 2.1-compliant embedded NAND flash for automotive applications

Toshiba Memory Europe has begun sample shipments of embedded NAND flash memory products for automotive applications that are compliant with JEDEC UFS version 2.1. The new products meet AEC-Q100 Grade 2requirements, support the wide temperature range of -40C to +105C, and offer the enhanced reliability capabilities that are required by increasingly complex automotive applications. The new embedded NAND flash memory products combine NAND chips fabricated with 15nm process technology and a controller in one package. Five different capacities of 16GB, 32GB, 64GB, 128GB and 256GB support a variety of automotive applications. These include infotainment, which usually needs high-capacity storage, and wireless communications, that may need only a small capacity. The company’s UFS products have been used to boost overall system performance in mobile devices, and the introduction of automotive UFS products is expected to have a similarly positive impact on the development of automotive information and entertainment systems.