High-end motherboard scales across all processor sockets
01-02-2018 |
Congatec
|
Subs & Systems
Congatec has introduced the conga-IT6, a Mini-ITX embedded motherboard for high-end applications offering high scalability across all suitable embedded processor sockets thanks to its COM Express Type 6 slot. Users of the new board can scale their applications over all relevant processor generations and manufacturers as needed, which keeps up-to-date with the latest developments in high-end embedded computing. This scalability enables flexible high-end performance classes from Intel Core i7 and Intel Xeon E3 processors to future designs – for instance, based on the AMD Zen architecture. The new embedded motherboard also increases the long-term use of current Mini-ITX motherboard designs, since discontinued processor modules are simply updated by swapping in new modules without any board modifications.
“Next to our standard product portfolio of industrial Mini-ITX boards with soldered processors, there are a number of customers who prefer function-identical embedded motherboards with a much more flexible processor design, because they always want to integrate the highest performance possible. If they further require long-term availability or want to develop highly scalable product families, they are best served by our new embedded Mini-ITX board,” explains Jürgen Jungbauer, product manager for Single Board Computers at Congatec. “Examples of such high-end embedded applications include broadcasting equipment and infotainment systems as well as medical workstations that thanks to the modular design also benefit from simplified certification as medical computers.”
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