Low-cost high-density PCB stacking connectors ensure interface consistency

23-08-2018 | RS Components | Connectors, Switches & EMECH

RS Components has introduced the Amphenol ICC BergStak Lite 0.8mm vertical mating PCB-to-PCB connector system. An economical yet versatile connector range with a multiplicity of configuration options, The system is especially well suited to high-density, high-speed parallel board stacking applications in IP phones, measurement equipment, portable industrial terminals, POS terminals, security systems and test equipment. The system comprises straight PCB headers and sockets with a choice of 40, 60, 80 or 100 contact positions arranged at 0.8mm pitch in one to four rows. A selection of 16 PCB stacking heights is offered, in 1mm increments from 5mm to 20mm. Design engineers are therefore presented with a consistent mating interface across a wide variety of formats to support evolving designs and mechanical requirements. Depending on stack height, the system can support data rates of up to 12Gbit/s — compatible with PCIe version 3 and SAS 3.0 high-speed bus performance. The 0.8mm contact pitch preserves PCB space for high-density applications. Inexpensive gold flash plating on the contact areas maintains 50 mating cycles, while a scoop-proof housing stops terminal damage due to reverse mating. Optional PCB locator pegs support easy, accurate manual assembly. The system has an operating temperature range from –40C to +125C and is available in a UL94 V-0 rated flame retardant LCP (liquid crystal polymer) material. It is RoHS compliant and lead-free.
ads_logo.png

By Electropages

Electropages is a trusted source of news and insights from the global electronics industry. With a dedicated team of experts and editors, Electropages delivers in-depth articles, product updates, and market trends across sectors such as embedded systems, IoT, connectors, and power solutions. Our mission is to empower engineers and professionals with the knowledge they need to innovate and succeed in a rapidly evolving technological landscape.