Shield cover can minimise crosstalk and reduce electromagnetic susceptibility

Due to the growing demand for IoT designs, thinner and lighter devices with quicker design turnaround times, TE Connectivity has introduced a new standard portfolio of Board Level Shields with the capability to minimise crosstalk and reduce electromagnetic susceptibility. They are available now from RS Components. The cover comes in a two-piece solution, one with a minimum height of 0.85mm height; the other is a one-piece solution offering a minimum height of 0.7mm. The cover offers corner shape, carrier attachment, SMT (castellations), bending radii, pick and place features, through holes, locking holes, locking and contact dimples. The company also offers extensive experience in EMI, stamping, plating, and automation with globally deployed field application engineers for local support.