New heat sink device provides non-inductive, high heat dissipation
22-08-2018 |
New Yorker Electronics
|
Connectors, Switches & EMECH
New Yorker Electronics now distributes a high stability heat sink device with enhanced power size ratio and optimum heat dissipation. The new Tepro TO-220 Non-Inductive, Thick-Film Heat Sink Resistor in the TO-20 Type is ideal application for switching power supplies and different types of pulse circuits.
The product is a miniature device that provides a high stability thick-film element, plated copper heat sink, and tinned copper leads. It also features high-temperature thermoset moulding.
Custom models are offered with variations in lead length, tolerance to 0.5%, and temperature coefficients. It is terminal strength tested at a 5lb pull and its solderability and solvent resistance meet MIL-STD-202 requirements.
By Electropages
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