Triple buffer/driver offers breakthrough in IC packaging concepts

The Texas Instruments SN74LVC3G07 Triple Buffer/Driver is created for 1.65V to 5.5V VCC operation. This device uses NanoFree package technology and is a breakthrough in IC packaging concepts, utilising the die as the package. The output of the device is open-drain and can be connected to other open-drain outputs to execute active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32mA. This device is wholly specified for partial-power-down applications using I_off. The I_off circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The devices are AEC-Q100 qualified for automotive applications.