Low profile rectifiers save space, increase power density and improve efficiency

04-02-2019 | Vishay | Power

Vishay Intertechnology has expanded its range of surface-mount TMBS Trench MOS Barrier Schottky rectifiers with 15 new 1A, 2A, and 3A devices in the eSMP series low profile SMF package. Affording space-saving alternatives to Schottky rectifiers in the SMA, these devices highlight reverse voltages from 45V to 150V, while their 3A rating is the industry’s highest for the SMF package. Currently, Schottky rectifiers with current ratings to 3A are typically available in the SMA package. The devices released increase power density by offering this high forward current in the smaller SMF. Measuring 3.7mm x 1.8mm with a low 0.98mm profile, the package is 46% thinner than the SMA and uses 49% less board space. The new rectifiers provide a maximum operating junction temperature up to +175C and an MSL moisture sensitivity level of 1, per J-STD-020, LF maximum peak of +260C. Ideal for automated placement, the devices are RoHS-compliant and halogen-free.
ads_logo.png

By Electropages

Electropages is a trusted source of news and insights from the global electronics industry. With a dedicated team of experts and editors, Electropages delivers in-depth articles, product updates, and market trends across sectors such as embedded systems, IoT, connectors, and power solutions. Our mission is to empower engineers and professionals with the knowledge they need to innovate and succeed in a rapidly evolving technological landscape.