07-10-2020 | General Silicones | Subs & Systems
General Silicones has released details of its new and improved ACF (Anisotropic Conductive Film) bonding sheets, ideal for LCD panel manufacturing and for other industries that employ a hot pressing process. The company has supplied leading panel manufacturers for many years. Now, meeting the need for higher resolutions in the panel industry, they have developed new ACF bonding sheets that fulfil all customer needs and improve the pressing process to assure accuracy.
The display panel market is shifting towards narrower borders and finer pitch design needs. Avoiding size variations of the electrodes due to pressure variations and assuring accurate positioning is becoming essential, and, therefore, the heat press process has to be closely controlled.
The company can offer products which satisfy these demands. Even after ten heat presses, the bonding sheets, such as GSC-84016, show remarkably little change in thickness and thermal conductivity. The bonding sheets are also free of problems with residual glue after the process is finished and can provide high tear strengths of 33.2kgf/cm and high durability.
