27-10-2021 | Bostik | Subs & Systems
Bostik has extended its Born2Bond engineering adhesive range created to support the electronics manufacturing sector in the assembling, waterproofing, dust-proofing and serviceability of miniaturised electronics such as wearables and handheld devices, and bigger applications included smart meters and LED lights.
The MECA-based cyanoacrylates and innovative dual-cure Light Lock adhesives are already offered for electronics OEMs for high-precision instant bonding, encapsulation and potting applications. Together with automatic dispensing solutions, they offer high performing and convenient options for designers and engineers.
The new versatile and single-component High-Performance HMPUR (Hotmelt Polyurethane Reactive) range has been created specifically for the manufacture of miniaturised handheld and wearable electronic devices, including mobile phones, smart watches and headphones. The products are available with various viscosities and open times to accommodate different applications and assembly processes.
Ideal for handheld devices and wearable technology, Born2Bond High-Performance HMPUR adhesives deliver excellent bonding performance (both rigid and elastic) and are capable of withstanding fluctuations in temperature and humidity, as well as being resistant to impact and chemical or organic compounds such as sweat or sebum.
Born2Bond new UV-CIPG (UV Cure-in-place Gasket) range offers single-component, precise gasketing solutions with typically 0.5-2mm high gaskets for waterproofing, dust proofing and serviceability of mobile phones, tablets, smartwatches, digital cameras, and automotive applications including BMS, ECU and ADAS. The adhesives provide excellent adhesion to various substrates, including plastic, glass and metal – and offer an effective and cost-efficient solution to cut or moulded gaskets that are generally assembled by hand with notable labour costs and carry a high risk of defect. They also exclude the demand for investment in expensive and space-consuming equipment such as moulds and ovens.
For larger applications such as smart meters and LED lights where 2-5mm-high gaskets are needed for dust and waterproofing, It’s UV-FG (UV Foam Gasket) range offers a fast-curing alternative to moulded gaskets that can readily be integrated into manufacturing lines. Its single-component design means mixing is not needed, and a high-foam expansion enhances resilience through the assembly process.
Polivio Goncalves, Bostik’s global head for engineering adhesives, says the range provides the exacting aesthetics and high performance demanded for miniaturised electronics engineering: “Wearable tech is a growing market and the requirement for ever-more-durable waterproof, and dustproof electronics is increasing. These ranges have been designed to support engineers as the market continues to develop.”
