20-05-2022 | Infineon | Connectors, Cables & Enclosures
Infineon Technologies Bipolar GmbH & Co. KG has expanded the high-power Prime Switch family with the new Press Pack IGBT (PPI) with internal FWD in Ceramic Disc Housings. This PPI is specifically created for transmission and distribution applications and is perfect for high current MMC, DC breakers, medium voltage drives, wind turbine converters and traction systems.
The device provides a blocking voltage of 4.5kV at 3000A with no FWD and 2000A with FWD. Fitting the 3000 PPI, the company offers external freewheeling diodes in four different silicon diameters: D1600U45X122, D2700U45X122, D3900U45X172 and D4600U45X172. The leading high-voltage IGBT chip trench technology and proven, high-reliable press-pack technology gives customers an excellent, high-performance solution for ultra-high power applications. Also, the devices open up new opportunities to optimise high-power applications in terms of losses, reliability and cost.
The PPI housing is hermetically sealed and particularly developed to withstand system-induced failures. In this way, it offers an extremely robust break resistance of the housing as well as a 'short-on-fail' feature. To cover multiple applications and power ranges, the internal chip-stack and housing design allows the company to produce a perfect fitting portfolio with different current values and topologies.