Leadless NTC thermistor dies offer versatile mounting options

Vishay Intertechnology, Inc has launched a new series of leadless NTC thermistor dies – contacted on the top and bottom – equipping designers with versatile mounting options. Vishay BCcomponents NTCC201E4 devices with silver metallisation support aluminium wire bonding and are compatible with reflow soldering under vacuum or with formic acid/forming gasses, SAC or SMP soldering, and nano-silver paste sintering.

Operating across a wide temperature range from -55C to +175C, the AEC-Q200 qualified devices are optimised for temperature sensing, control, and compensation in automotive and alternative energy applications. End products cover IGBT and power MOSFET modules and power inverters for EV and HEV, solar panels, and wind turbines.

The top and bottom metallisation of the thermistors feature two layers. An external layer provides superior resistance to soldering leaching compared to previous-generation devices, particularly when utilising high melting point solder materials at temperatures to +360C. An internal layer resists board formic acid etching when solder preforms are employed and forming H2/N2 gasses.

RoHS-compliant, halogen-free, and Vishay Green, the thermistors provide resistance at +25C (R25) from 4.7kOhm to 20kOhm, with tolerance down to ±1%, and beta (B25/85) from 3435K to 3865K, with tolerance down to ±1%. The devices feature maximum power dissipation of 50mW, response times of 3s, and are packaged in PS blister tape.