Automotive planar Schottky diodes provide superior heat dissipation in small footprint size

Nexperia now provides a portfolio of 22 new planar Schottky diodes in CFP3-HP packaging. The portfolio includes 11 industrial and 11 AEC-Q101-qualified products. This release supports the growing trend for manufacturers to substitute devices in SMx-type packaging with smaller footprint CFP-packaged devices, particularly in automotive applications. These diodes are suited for use in, for example, DC-DC conversion, freewheeling, reverse polarity protection and OR-ing applications.

This portfolio offers device options with reverse voltages VR(max) ranging from 30V to 100V and forward currents IF(average) between 1A and 3A for maximum design flexibility. The exposed heatsink, a feature of the CFP3-HP, allows it to supply the highest heat dissipation (Ptot) for such a small package footprint (3.7mm x 1.8mm x 0.9mm).

"As the industry transitions to smaller packages like CFP, Nexperia is committed to actively contributing to this shift, reinforcing our dedication to packaging innovation," says Frank Matschullat, product group manager of Power Bipolar Discretes at Nexperia. "With substantial investments in capacity expansion, we are poised to meet the increasing demand for CFP-packaged products, surpassing market expectations for the next three years. These diodes mark the latest additions to our extensive portfolio of over 270 CFP-packaged products."

Using the proprietary copper clip design, these packages fulfil the challenging demands of efficient and space-saving designs. Today, CFP packaging is employed by different power diode technologies, such as the company's Schottky and recovery rectifiers, but can also be extended to bipolar transistors. It offers notable product diversity. This further solidifies its position as a leader in packaging innovation, offering customers the most comprehensive range of device options from a semiconductor manufacturer with a trusted supply chain.