Archive - April 2024

Ultra-high-efficiency AC/DC ZVS flyback architecture unveiled

03-04-2024 | Eggtronic | Power

Industrial power supplies feature low output noise with long field life and Class B EMI

03-04-2024 | TDK | Power

New MCUs with high-resolution analog and OTA update

03-04-2024 | Renesas | Semiconductors

Leading engineers into the future with immersive technology resource hub

03-04-2024 | Mouser Electronics | Test & Measurement

New automotive N-channel MOSFETs offer excellent thermal performance

05-04-2024 | Toshiba | Power

Terminal blocks for high-temperature applications

05-04-2024 | Rutronik | Industrial

Microcontrollers with expanded code flash memory capacity to support firmware updates

08-04-2024 | Toshiba | Semiconductors

New top-side cooling package for power MOSFETs enables highest efficiency

08-04-2024 | Infineon | Power

The latest generation of debuggers extends product range

08-04-2024 | TASKING | Test & Measurement

Industry's first general-purpose 32-bit RISC-V MCUs with internally developed CPU core

08-04-2024 | Renesas | Semiconductors

Primary battery for portable and small electronic devices in customisable blister packs

08-04-2024 | Rutronik | Power

Multiprotocol module for wireless IoT applications

08-04-2024 | Mouser Electronics | Industrial

First BLE and Matter wireless MCU to feature neural co-processor for AI/ML workloads

09-04-2024 | Alif Semiconductor | Semiconductors

High-power reed relays offer alternative to mercury wetted reed relays or electromechanical relays

09-04-2024 | Pickering | Power

Intelligent vision ecosystem launched

09-04-2024 | Arrow | Test & Measurement

New SPDT toggle switches with SMA connectors bring flexibility and easy operation

09-04-2024 | Pasternack | Industrial