Next-gen thermoelectric cooling technology boost cooling performance in enclosures and cabinets

Laird Thermal Systems has released a new high-performance thermoelectric cooler assembly series that uses next-generation thermoelectric coolers with advanced semiconductor materials. This enhancement boosts cooling performance by up to 10% over previous models. Combined with a high-performance heat sink and fan shroud assembly, the ultra-compact SuperCool X Series can transfer heat to ambient environments more rapidly than legacy systems. The series is designed for sample storage compartments typically found in analytical instrumentation or medical diagnostic chambers with tight geometric space constraints.

An array of high-performance thermoelectric coolers is at the centre of every cooler assembly. These high-performance thermoelectric coolers are manufactured with advanced thermoelectric materials that supply increased cooling capacity for the series' assembly. The next-generation thermoelectric coolers maintain a high coefficient of performance to minimise the amount of input power needed for operation and lower the heat rejection requirement on the hot side.

The series contains three model types that supply design engineers with several heat transfer mechanisms on the control side. Heat can be absorbed via convection (air-to-air), conduction (direct-to-air), or liquid (liquid-to-air). The Liquid-to-Air Models SLAX have a cooling capacity of up to 400W, while the Direct-to-Air Models SDAX have up to 220W and the Air-to-Air Model SAAX have up to 175W of heat pumping capacity. All cooling capacities were measured at ΔT=0C and Tamb = 35C with a nominal operating voltage of 24VDC. These compact, refrigerant-free thermoelectric cooler assemblies offer an environmentally friendly alternative to compressor-based systems for precise temperature control.

"The SuperCool X Series is a high-performance and ultra-compact thermoelectric cooler assembly for medical diagnostics chambers and analytical instrument sample storage compartments," said Andrew Dereka, product director at Laird Thermal Systems. "This product series addresses the market needs for shrinking form factors, higher cooling capacities and environmentally friendly solutions with no global warming potential."

These thermoelectric assemblies can be used for heating or cooling, depending on the application. Custom configurations are obtainable upon request.