High-performance embedded computing for demanding applications

Review Display Systems now offers two new COM-HPC modules from AAEON. The HPC-RPSC and HPC-ADSC modules support 12th and 13th-generation Intel Core processors and have been developed to deliver high-performance embedded computing for demanding applications. The HPC-RPSC module hosts over ten PCIe devices, a comprehensive high-speed I/O, and expandable SSD-based storage.

Supporting CPUs with up to 24 cores and 32 threads, the HPC-RPSC can manage complex parallel simulations, analyse testing data using inference modelling, and adjust clock speeds for efficient task execution using Intel Turbo Boost Technology. The module features up to 64GB of DDR5 SODIMM memory and PEG 5.0 and PCIe 4.0 slots, allowing it to manage large datasets and integrate specialised hardware such as high-speed data acquisition or test and analysis equipment.

The device provides extensive expansion options, including a PEG 5.0 slot for advanced GPU integration, three PCIe 4.0 slots, and eight PCIe 3.0 slots. Dual 2.5GbE Intel I226-LM Ethernet ports also ensure high bandwidth for data exchange. The module provides flexible SATA and NVMe storage support, while onboard TPM 2.0 enhances data security through edge encryption.

The device has six USB 3.2 and two Ethernet ports for camera and sensor integration. With Intel UHD Graphics 770 and PEG slot support for graphics cards, the board allows real-time analysis of multiple video streams.

The HPC-ADSC module delivers a slightly reduced function set compared to the HPC-RPSC. It supports only 12th-generation Intel Core processors, has ten PCIe slots, offers just one USB 3.2 Gen 2x2 port, has reduced Ethernet functionality through PCIe slots, and has reduced support for advanced graphic cards. The HPC-RPSC is a more powerful and expandable board compared to the HPC-ADSC, with support for the latest 13th-generation Intel Core Processors, extra PCIe slots, faster USB ports, and advanced graphics support.

The COM HPC Client Size C module form factor has 160mm (l) mechanical outline dimensions x 120mm (w).

The key features of the devices ensure that performance intensive applications such as test equipment, edge AI servers, and remote monitoring systems can be easily implemented.