Cutting-edge vertical power architecture for AI and HPC processors

FinFast-enabled Crescendo platform relocates underneath the xPU processor for immediate computing performance, density and efficiency gains

Empower Semiconductor is demonstrating its new Crescendo platform with FinFast technology at electronica 2024. Experience the first European demonstration of scalable true vertical power for AI and HPC at the show.

The Crescendo platform – a scalable on-demand true vertical power architecture for upwards of 3,000A power domains – incorporates all power components in a single device thin enough to relocate underneath the processor and supply on-demand kilowatt power with unmatched speed and accuracy. It eradicates virtually all capacitor banks, reducing board space by 5x and lowering system power losses by up to 20%.

Designed to meet AI processors' pressing power delivery challenges, the platform harnesses the company's FinFast technology to uniquely integrate advanced silicon processes, magnetics and silicon capacitors with breakthrough control architectures in a thermally efficient power package.

"Bringing Crescendo to electronica is an important and proud milestone for Empower," stated Eric Pittana, senior director of global marketing and EMEA sales for Empower Semiconductor. "Following the strong reception, we received during the unveil in the U.S. market in October, we're eager to demonstrate to our European customers how Crescendo is the answer to their kilowatt-range power delivery problem."

Visit the company at electronica 2024, Hall B4, Booth #110 on the show floor at the Messe München, November 12-15, 2024.