First complete memory interface chipset solutions for second-generation DDR5 server MRDIMMs

Renesas Electronics Corporation has delivered the industry’s first complete memory interface chipset solutions for the second-generation DDR5 MRDIMMs.

The new DDR5 MRDIMMs must keep pace with the ever-increasing memory bandwidth demands of AI, HPC and other data centre applications. They deliver operating speeds up to 12,800MT/s, a 1.35x improvement in memory bandwidth over first-generation solutions. The company has been instrumental in the design, development, and deployment of the new MRDIMMs, collaborating with industry leaders, including CPU and memory providers and end customers.

The company has designed and executed three new critical components: the RRG50120 second-generation Multiplexed Registered Clock Driver (MRCD), the RRG51020 second-generation Multiplexed Data Buffer (MDB), and the RRG53220 second-generation PMIC. It also provides mass production temperature sensor (TS) and serial presence detect (SPD) hub solutions, making it the only memory interface company offering complete chipset solutions for industry-standard next-generation MRDIMMs and all other server and client DIMMs.

“The demand for higher performance systems driven by AI and HPC applications is relentless,” said Davin Lee, Senior Vice President and General Manager of Analog and Connectivity and Embedded Processing. “Renesas is at the forefront of this trend, working with industry leaders to develop next-generation technology and specifications. These companies depend on Renesas to deliver the technical know-how and production capabilities they require to meet unprecedented demand. Our latest chipset solutions for second-generation DDR5 MRDIMMs showcase our leadership in this market.”

The company’s RRG50120 second-generation MRCD is used on the MRDIMMs to buffer the Command/Address (CA) bus, chip selects and the clocks between the host controller and DRAMs. It consumes 45% less power than the first-generation device, a critical specification for heat management in very high-speed systems. The RRG51020 Gen2 MDB is the other key device used in the MRDIMMs to buffer data from the host CPU to DRAMs. The new MRCD and MDB support speeds up to 12.8Gbps. The RRG53220 next-generation PMIC offers best-in-class electrical-over-stress protection and superior power efficiency and is optimised for high-current and low-voltage operation.