New series of micro thermoelectric coolers for next-generation optoelectronic packages

Laird Thermal Systems launches the OptoTEC™ MBX Series, a line of micro thermoelectric coolers for high-performance space-constrained optoelectronic applications. Leveraging next-generation thermoelectric materials and advanced process automation, the MBX Series offers new configurations designed for integration into TO-Can, TOSA, and Butterfly packages. The latest design innovation includes a compact footprint, with the smallest model measuring just 1.5mm x 1.1mm and profiles as thin as 0.65mm, ensuring exceptional cooling performance in given space constraints at the lowest possible power consumption.

The series offers high heat pumping densities up to 43W/cm2 with temperature differentials up to 82C at an ambient of 50C. Ensuring efficient thermal management and precise temperature stabilisation, the series protects optoelectronics that operate in high-temperature environments, including laser diodes, optical transceivers, LiDAR, IR Sensors, and high-powered InP VCSELs.

"Advancements in the optical communications industry, driven by applications such as artificial intelligence and machine learning, require superior temperature stabilisation for laser diodes in high-speed optical transceivers," said Andrew Dereka, Thermoelectrics Product Director at Laird Thermal Systems. "The MBX Series is the ideal solution to ensure optical devices maintain consistent wavelength, reduced crosstalk, and extend operational lifespan. Our large investment in a high precision automation production line reflects our commitment to process control, high-volume capacity and reliability."

The series has undergone rigorous Telcordia GR-468 CORE qualification testing, providing excellent reliability and long operational life even in harsh environments to satisfy the highest qualification and reliability standards in the optoelectronic market. Engineered to order, the MBX Series permits for unique form factors, heat pumping densities and power efficiencies. With solder constructions supporting reflow temperatures up to 280C and wire-bondable attachments, this series is appropriate for various optoelectronic applications. The company also offers special finishing options, including Au-plated patterns, thermistor attachments and hermetic sealing to accommodate non-hermetic packaging.