Bluetooth 5.3 module for smart homes, IIoT and smart medical

04-02-2025 | Rutronik | Semiconductors

Rutronik's wireless portfolio includes the LBEE5XV2EA-802 Type 2EA combo module from Murata. The Wi-Fi 6E, 2 x 2 MIMO and Bluetooth BR/EDR/LE 5.3 module is based on Infineon's AIROC SoC CYW55573 and is designed for Linux and Android. The surface-mountable module supports the WLAN interfaces PCIe 3.0 Gen2, SDIO 3.0/2.0, as well as the Bluetooth interfaces HCI UART, PCM and I2S, and is suitable for use in applications such as smart home, medical, industrial or video, audio and voice streaming thanks to its wide operating temperature range of -40C to 85C. The components are certified for the US, Canadian, EU and Japanese markets, are RoHS compliant and available in REEL packaging.

The module with tri-band capability (2.4GHz, 5GHz and 6GHz) and 2 x 2 MIMO is available with 20MHz, 40MHz and 80MHz channels and supports the WLAN standard IEEE 802.11 with the extensions a, b, g, n, ac and ax. It manages a data volume of up to MCS11 data rates (1,200Mbit/s). The components are particularly powerful at a small size of 12.5mm x 9.4mm x 1.2mm and a weight of just 360mg and have connections for external antennas.

Typical application examples include industrial IoT, smart home, video, audio and voice streaming, xR (AR/VR) devices, gateways, wireless handheld systems, and wearables.


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By Seb Springall

Seb Springall is a seasoned editor at Electropages, specialising in the product news sections. With a keen eye for the latest advancements in the tech industry, Seb curates and oversees content that highlights cutting-edge technologies and market trends.