Innovative satellite navigation receiver for automotive and industrial applications

STMicroelectronics has introduced the Teseo VI family of GNSS receivers aimed at high-volume precise positioning use cases. For the automotive industry, Teseo VI chips and modules will be core building blocks of ADAS, smart in-vehicle systems, and safety-critical applications such as autonomous driving. They have also been developed to improve positioning capabilities in multiple industrial applications, including asset trackers, mobile robots for home deliveries, managing machinery and crop monitoring in smart agriculture, timing systems such as base stations, and many more.

“Our new Teseo VI receivers represent a real breakthrough among positioning engines for several reasons: they are the first to integrate multi-constellation and quad-band signal processing in a single die; they are the first to embed a dual-Arm-core architecture enabling both very high performance and ASIL-level safety for assisted and autonomous driving applications. Last but not least, they embed ST’s proprietary embedded Non-Volatile-Memory (PCM), thus delivering a very integrated, cost-effective, and reliable platform for new precise-positioning solutions,” said Luca Celant, Digital Audio and Signal Solutions, general manager, STMicroelectronics. “ST’s new satellite-navigation receivers will support exciting, advanced capabilities in automotive ADAS applications and enable many new use cases being implemented by industrial companies.”

The receiver is the first in the market to incorporate all the necessary system elements for centimetre accuracy into one die, supporting simultaneous multi-constellation and quad-band operations. This innovation simplifies the development of end-user navigation and positioning products, improves reliability even in challenging conditions like urban canyons, and reduces BOM costs. Also, the single chip accelerates time to market and allows for compact and lightweight form factors.

The new family of precise positioning receiver chips employs decades of experience and integrates multiple ST proprietary technologies, including precise positioning and advanced embedded memory.

The Teseo VI product family is supported by an established ecosystem of suppliers and partners for algorithms, reference designs, and compatible complementary hardware.

The Teseo VI product family also includes two new GNSS automotive modules: the Teseo-VIC6A in a 16mm x 12mm form factor (embedding Teseo VI) and the Teseo-ELE6A in a 17mm x 22mm form factor (embedding Teseo VI+). These new modules simplify the integration of Teseo VI/VI+ ICs on the customer platform and ensure optimum performance.