New low-power BLE SoC for automotive applications

Renesas Electronics Corporation has released a new industry-leading Bluetooth chip that combines a radio transceiver, an Arm M0+ MCU, memory, peripherals and security features in a compact SoC design. The DA14533, the first automotive-qualified device in the company's BLE SoC family, includes advanced power management features to simplify system integration and lower power consumption. With its software stack qualified against Bluetooth Core 5.3 and support for extended temperatures, developers can jump-start projects in applications from tyre pressure monitoring and keyless entry to wireless sensors and battery management systems.

Building on the company's leadership in BLE SoCs (SmartBond Tiny Family) with industry-leading low power consumption, the new device includes some of the industry's most advanced power management features. The device includes an integrated DC-DC buck converter, which accurately adjusts the output voltage according to system requirements. Active system power consumption is lower than comparable devices in the market, needing only 3.1mA during transmission and 2.5mA during reception. In hibernation mode, the current drops to 500nA. These power management and power-saving features help extend the operational life of small-capacity battery-powered systems and fulfil the stringent power requirements of tyre pressure monitoring systems' mission profile.

The device is an AEC-Q100 Grade 2 qualified device, which indicates the device has passed strict testing to sustain quality and reliability in harsh automotive environments. Furthermore, the device's extended temperature range (-40C to +105C) ensures reliable performance in demanding conditions, making it excellent for automotive and industrial systems where stability and durability are essential. Qualified against Bluetooth Core 5.3 specifications, the device contains the latest security features to safeguard connected devices from various threats.

"Our SmartBond Tiny SoC family has seen remarkable success in the industrial market, with over 100 million units shipped to date," said Chandana Pairla, VP of Connectivity Solutions Division at Renesas. "This new automotive-grade device will enable a new class of BLE applications that demand high power efficiency, a small footprint and broader temperature tolerance for next-generation battery-powered automotive and industrial systems."

Similar to other BLE SoC devices in the SmartBond Tiny family, the DA14533 only requires six external components, offering a best-in-class engineering bill of materials (eBOM). A single external crystal oscillator (XTAL) is used for active and sleep modes, eradicating the necessity for a separate oscillator for sleep mode. Its ultra-compact design – available in a WFFCQFN 22-pin 3.5mm x 3.5mm package – makes the device the smallest automotive BLE SoC on the market. With its compact design and low eBOM, the device incorporates seamlessly into space-constrained systems, lowering overall system costs and accelerating time-to-market for customers.

The company has combined the new BLE SoC with the R-Car H3/M3/E3 SoCs, PMICs, and timing devices to deliver a wide array of Winning Combinations, including the 'Tire Pressure Monitoring System'.