A collaboration on a 28nm embedded flash (eFlash) process for making microcontrollers (MCUs) aimed at green and autonomous vehicles applications has been agreed between pure-play f
Articles | 01-09-2016
A collaboration on a 28nm embedded flash (eFlash) process for making microcontrollers (MCUs) aimed at green and autonomous vehicles applications has been agreed between pure-play f
Insights | 01-09-2016
Californian wearable technology specialists NFCRing says it has developed the world's first EMVCo compliant payment ring. The ring is based on a contactless security chip manufactu
Articles | 23-08-2016
Californian wearable technology specialists NFCRing says it has developed the world's first EMVCo compliant payment ring. The ring is based on a contactless security chip manufactu
Insights | 23-08-2016
Semiconductor and intellectual property company EnSilica has agreed to provide configurable ASICs specialist BaySand’s ASIC UltraShuttle-65 multi-project wafer (MPW) customers with
Articles | 18-08-2016
Semiconductor and intellectual property company EnSilica has agreed to provide configurable ASICs specialist BaySand’s ASIC UltraShuttle-65 multi-project wafer (MPW) customers with
Insights | 18-08-2016
A fault-tolerant and fail-safe system for train control and rail signaling has been developed by Artesyn Embedded Technologies. Safety Integrity Level 4 (SIL4) certification has be
Articles | 16-08-2016
A fault-tolerant and fail-safe system for train control and rail signaling has been developed by Artesyn Embedded Technologies. Safety Integrity Level 4 (SIL4) certification has be
Insights | 16-08-2016
The industry’s first end-to-end security solution for Internet of Things (IoT) devices that connect to Amazon Web Services (AWS) IoT has been developed following collaboration betw
Articles | 11-08-2016
