Link Microtek has launched a new miniature single-channel coaxial rotary joint that provides a broad operating frequency range of DC to 40GHz, making it ideal for a variety of test applications. Particularly, it would be excellent for EM

Link Microtek Ltd | 07-01-2020

Cinch Connectivity Solutions, a Bel group company, has expanded the Johnson cable assembly portfolio with a new SMA-SMA and SMA-MMCX connector interfaces. These cable assemblies are generally employed in GPS modules, LAN router and WAN syst

Cinch | 07-01-2020

Master Bond EP30DPBFMed is a two-part, flexibilized epoxy-urethane hybrid system for bonding, coating, sealing, and encapsulation. It is formed for disposable and reusable medical devices, satisfying USP Class VI requirements while also com

Masterbond | 07-01-2020

Advice available from the company’s specialists begins with Southern Manufacturing and Electronics, which includes guidance on selecting the best device form-factor - and technology inside the device - to achieve levels of security that sim

Nexus Industrial Memory | 06-01-2020

Elesa announced that their wide range of hinges and connection products continues to diversify to satisfy customer needs. The company's wide range of hinges and connections in plastic or metal stretches across standard products in techno

Elesa | 03-01-2020

The Peak-System's new I/O module PCAN-MicroMod FD is, in addition to its application as a plug-in module for in-house developments, now also offered with ready-to-use motherboards in black aluminium profile casings. The devices provide peri

PEAK-System | 03-01-2020

TE Connectivity's ELCON Micro Wire-to-Board Power Solutions, available now from Mouser, provide a high current density up to 12.5A per pin (maximum) in the common industry footprint of 3mm (contact pitch). This common industry footprint giv

Mouser Electronics | 20-12-2019

U-blox has announced its latest ultra-small, high-performance Bluetooth low energy 5.0 module, the BMD-380. Measuring only 7.5mm x 9.5mm including the ceramic antenna, it features Bluetooth 5.0 specifications, with its long-range proto

U-Blox | 20-12-2019

Aiding engineers dealing with EMI/RFI issues in their PCB designs, Harwin has introduced three new shielding cans. Supplied in a tape-and-reel format, these cans expand the company’s existing range of EMC products. The dimensions for the ca

Harwin | 20-12-2019

The Analog Devices ADRF5545A RF front end module from is a dual-channel integrated RF receiver front-end module designed for time-division duplexing and massive multiple-input and multiple-output (mMIMO) applications that operate in the 2.4

Analog Devices | 19-12-2019

Digilent has introduced the Genesys ZU, a cost-effective and powerful Zynq UltraScale+ MPSoC development board loaded with peripherals and an extensive ecosystem of add-on modules. The device is a standalone board created with optimised spe

Digilent | 19-12-2019

Aldec has launched a powerful, versatile and time-saving FPGA-based NVMe Data Storage solution to assist in the development of High-Performance Computing applications such as High-Frequency Trading and Machine Learning. The solution comp

Aldec | 17-12-2019

Inseto now supplies DELO’s new MONOPOX TC2270, a thermally conductive, electrically insulating adhesive, which is excellent for bonding silicon die and other applications where rapid heat transfer is vital. With a specific thermal conduc

Inseto (UK) Ltd | 17-12-2019

Fujikura Ltd now offers its latest evolution in the development of the fusion splicer with the launch of the new 90S. The 90S incorporates a whole host of new and enhanced features particularly developed to allow the user to work faster

Fujikura | 13-12-2019