Vishay Intertechnology, Inc. has introduced five new half-bridge IGBT power modules in the newly redesigned INT-A-PAK package. Built on Vishay's Trench IGBT technology, the VS-GT100TS065S, VS-GT150TS065S, VS-GT200TS065S, VS-GT100TS065N, and

Vishay | 26-02-2024

u-blox now offers its new NORA-W4 module. With its comprehensive range of wireless technologies (Wi-Fi 6, Bluetooth LE 5.3, Thread, and Zigbee), compact form factor (10.4mm x 14.3mm x 1.9mm), and affordability, it is ideal for IoT applicati

U-Blox | 26-02-2024

Microchip Technology has introduced the 3.3kV XIFM plug-and-play mSiC gate driver with patented Augmented Switching technology, designed to work out-of-the-box with preconfigured module settings to reduce design and evaluation time signific

Microchip Technology | 23-02-2024

Micron Technology, Inc. has announced two new Crucial Pro Series products with the addition of overclocking-capable memory and the world’s fastest Gen5 SSD. The Crucial DDR5 Pro Memory: Overclocking Edition modules are obtainable in 16GB de

Micron | 23-02-2024

Infineon Technologies AG has introduced the OPTIGA Trust M MTR. The Matter-certified Secure Element is the latest configuration of its OPTIGA Trust M, combined with a Matter provisioning service. According to ABI Research forecasts, the

Infineon | 23-02-2024

Pasternack has released its innovative standard gain horn antenna radome covers. Meticulously designed, they protect a wide array of waveguide horn antennas, providing optimal functionality and resilience in outdoor settings. The standar

Pasternack | 23-02-2024

CEA-Leti scientists and the University of California San Diego have created a ground-breaking piezoelectric-based DC-DC converter that unifies all power switches onto a single chip to increase power density. This new power topology stretche

CEA-Leti | 23-02-2024

Schurter has introduced its new MSM II AE Metal Line indicator series, created to complement its recently launched MSM II Metal Line pushbutton switch series. The new range of indicators serves to seamlessly integrate with the switch series

Schurter | 23-02-2024

Renesas Electronics Corporation announced it has developed circuit technologies for an embedded spin-transfer torque magnetoresistive random-access memory (STT-MRAM, from now on MRAM) test chip with fast read and write operations. Fabricate

Renesas | 23-02-2024

Mouser now stocks the STM32WL5MOC multiprotocol LPWAN dual-core module from STMicroelectronics. The LPWAN module features two Arm Cortex-M cores, the M4 and M0+. It integrates a powerful and ultra-low-power LPWAN-compliant radio solution

Mouser Electronics | 22-02-2024

Texas Instruments has introduced two new power conversion device portfolios to help engineers achieve more power in smaller spaces, providing the highest power density at a lower cost. Its new 100V integrated GaN power stages feature therma

Texas Instruments | 22-02-2024

LEMO has announced the launch of its enhanced product family portfolio aimed at simplifying the customer selection process. With a commitment to providing over 90,000 custom solutions tailored to fulfil specific needs, it continuously expan

LEMO | 22-02-2024

Murata has extended its line-up of high-Q-rated MLCC. Designed for high-frequency module applications such as those used in cellular communication infrastructure, the GJM022 series expands the world’s smallest high-Q capacitor with a voltag

Murata | 22-02-2024

Red Lion has announced its new strain gauge modules and J1939 and CAN protocol sleds designed to enhance and scale its FlexEdge Intelligent Edge Automation Platform. The new strain gauge modules are readily installable and configurable a

Red Lion | 22-02-2024