SemiQ will exhibit its latest portfolio of advanced SiC modules at the Applied Power Electronics Conference (APEC). Visitors to the company's booth will have the first opportunity to explore the latest QSiC 1200V SiC modules. These modul

SemiQ | 19-01-2024

TDK Corporation offers a demo kit for the mechanically decoupled ultrasonic sensor module USSM1.0 PLUS-FS. This component can be used for obstacle detection and distance measurement under demanding environmental conditions, including full s

TDK | 19-01-2024

Kyocera AVX has extended its broad portfolio of commercial surface-mount MLCCs by releasing its first safety-certified MLCCs, the new Class X1/Y2 KGK Series and Class X2 KGH Series. Class-X and Class-Y safety-certified capacitors are dev

Kyocera AVX | 19-01-2024

Novosense Microelectronics has extended its family of digital isolators with quad-channel devices that deliver the performance and protection demanded by the latest industrial and automotive applications. The new NSI824xWx high-reliability

Novosense Microelectronics | 19-01-2024

Amphenol Socapex has released a ruggedised USB Type-C connector, USB3CFTV, based on the MIL-DTL-38999 series III standard.The connector is a rugged solution designed to withstand harsh environments and demanding applications such as defence

Amphenol | 19-01-2024

Mouser now stocks the Siretta QUARTZ-GOLD-5G industrial routers. Created to transfer large amounts of data via the 5G NR cellular network, the routers are high-speed dual-port gigabit Ethernet industrial routers capable of reaching 2.4Gbps

Mouser Electronics | 18-01-2024

Infineon Technologies AG has combined its expertise in magnetic position sensors with its established linearised TMR technology to launch the XENSIV TLI5590-A6W magnetic position sensor. The sensor comes in a wafer-level package, ideal for

Infineon | 18-01-2024

Skylo Technologies has announced that Anritsu Corporation will enable OEMs and third-party test houses to conduct Skylo-defined testing of NTN devices using Anritsu test platforms. This collaboration will allow device, module, and chipset m

Anritsu | 18-01-2024

Today's power supplies, amplifiers, and servers perform at unprecedented levels. The thermal impact of this performance can be significant and may elevate the temperature above the recommended operating temperature for some components. S

Stackpole | 18-01-2024

Omron Electronic Components Europe has extended its MOSFET relay lineup to provide higher operating temperature and improved capacity in a high-current six-pin DIP format. Its new G3VM-63BR and G3VM-63ER extend the company's 60V DIP6 MOSFET

Omron | 18-01-2024

Mouser now stocks the IIM-20670 MotionTracking MEMS device from TDK InvenSense. The device is a robust SmartIndustrial six-axis IMU for tilt and stabilization applications. The device supports industrial applications requiring extreme tempe

Mouser Electronics | 17-01-2024

Advantech has released its latest high-performance AIMB-723 industrial ATX motherboards with AMD RYZEN Embedded 7000 Processors. This is the first industrial-grade motherboard integrated with the AMD B650 chipset, supplying high computing p

Advantech | 17-01-2024

Saelig Company, Inc. has introduced the Aaronia Spectran V6 ECO 100XA-6 real-time, high-performance spectrum analyser and monitoring receiver, developed to capture even the shortest and intermittent signal transmissions. With a remarkable s

Saelig | 17-01-2024

e-con Systems and Ambarella, Inc. have announced their partnership and the e-con Robotics Computing Platform (eRCP) launch. Based on Ambarella's flagship CV72S edge AI SoC, this new platform is specifically developed to satisfy the needs of

e-con Systems | 17-01-2024