Connectivity for high-performance compute and AI infrastructure

Alphawave Semi has announced a 9.2Gbps HBM3E subsystem (PHY + Controller IP) silicon platform. Based on the company's proven HBM3E IP, the platform takes chiplet-enabled memory bandwidth to new heights of 1.2TBps, addressing the demand for ultra-high-speed connectivity in HPC and accelerated compute for generative AI applications.

The company has successfully demonstrated its HBM3E IP subsystem at recent trade shows. Working with Micron, channel simulations have shown the highest level of performance of 9.2Gbps in an advanced 2.5D package across an entire HBM3E system, comprising the HBM3E IP subsystem, the company's innovative silicon interposer and Micron's HBM3E memory. These performance results demonstrate that the platform significantly reduces time-to-market by providing best-in-class industry performance and exceptional power efficiency for data centres and HPC AI infrastructures.

The subsystem has emerged as a top choice for memory in AI and HPC systems as it delivers the highest bandwidth, optimal latency, compact footprint and superior power efficiency. The company's customers are deploying complete HBM subsystem solutions that integrate the company's HBM PHY with a versatile JEDEC-compliant, highly configurable HBM controller that can be fine-tuned to maximise the efficiency of application-specific AI and HPC workloads.

The company has also created an optimised silicon interposer design to achieve best-in-class results for signal integrity, power integrity and thermal performance at 9.2Gbps.

"Micron is committed to advancing memory performance through our comprehensive AI product portfolio as the demand for AI continues to grow in data centres," said Praveen Vaidyanathan, vice president and general manager of Micron's Compute Products Group. "With their end-to-end channel simulations, we are pleased to see Alphawave Semi demonstrate a performance of 9.2Gbps for AI accelerators with HBM3E. Together, we are empowering customers to accelerate system deployment with our Micron HBM3E solutions, delivering up to 30% lower power consumption compared to competitive offerings."

"We are excited to lead the industry in delivering a complete 9.2Gbps HBM3E PHY and controller chiplet-enabled platform delivering 1.2TBps bandwidth, backed by channel simulations across the SoC, interposer and Micron's HBM3E memory," said Mohit Gupta, senior vice president and general manager, Custom Silicon and IP, Alphawave Semi. "Leveraging this, along with our leading-edge custom silicon and advanced 2.5D/3D packaging capabilities, allows Alphawave Semi to a provide a very significant time-to-market advantage to our hyperscaler and data centre infrastructure customers for their AI-enabled systems."