Embedded Flash solution delivers enhanced data retention and best-in-class operational reliability

X-FAB Silicon Foundries SE has announced a major innovation in NVM data storage that draws on its best-in-class SONOS technology. Fabricated on its high-voltage BCD-on-SOI XT011 platform, the company can supply customers with an AECQ100 Grade-0 compliant 32KB capacity embedded Flash IP, combined with an additional 4kbit EEPROM – all implemented on a 110nm semiconductor process node. Larger cuts of 64KB and 128KB flash and larger EEPROM are planned from 2025 onwards.

By taking a unique approach, the Flash and EEPROM elements are located inside a single macro and share the required control circuitry. This means a much simpler arrangement is realised, leading to a smaller overall footprint for the combined elements and setting a new industry benchmark for grade-0, 1750C capable, 32KB storage solution.

The Flash provides customers with the most advanced data access available, able to read data across its entire -40C to 175C temperature range, and the EEPROM can also write up to 175C. The EEPROM is advantageous for applications in which it is necessary to write more frequently, increasing Flash endurance and flexibility. It can also effectively act as a cache, with data programmed onto it while operating conditions are not suitable for writing to Flash before subsequently being written onto the Flash when the temperature drops below 125C. Thanks to superior robustness characteristics, continued data storage integrity and significant space savings offered, this IP is intended to fit the needs of automotive, medical and industrial applications.

The new NVM combo IP features a 64-bit bus with 8-bit ECC for the Flash element and a 14-bit ECC for the EEPROM element. This allows zero-PPM error performance in deployed devices integrating it. Dedicated circuitry for easy memory access and DFT allows test times to be notably shortened and the associated costs to be minimised. The company can also supply BIST modules and testing services if needed.

“Through this new NVM IP leveraging our proprietary SONOS technology, X-FAB is enabling the highest levels of reliability. This IP will provide our customers with best-in-class data retention and temperature stability for embedded systems,” explains Thomas Ramsch, director of NVM Development at X-FAB. “By bringing together two different NVM elements onto a single macro, one Flash and the other EEPROM, we can now deliver an embedded data storage solution capable of coping with most difficult operational situations.”

“Through reduced-footprint and accelerated access time, our NVM combo IP will be pivotal in the development of high-logic content applications,” adds Nando Basile, technology marketing manager for NVM solutions at X-FAB. ”This will enable next-generation smart sensors and actuators CPU system designs with greater functional scope - whether this is on established CPU architectures, like ARM, or RISC-V, or on customer’s proprietary designs.”