25-09-2023 | Insight SIP | Semiconductors
Insight SiP offers its ISP3080 UWB-BLE module. This device provides state-of-the-art integration and miniaturisation of RF technologies using SiP technology. The device also benefits from the company's proprietary, industry-leading 'Antenna-in-Package' techniques.
The device includes the latest generation of UWB technology from Qorvo in the QM31100 UWB chip, together with Nordic Semiconductor's nRF52833 BLE device. The next-generation UWB solution delivers massively improved power consumption compared with earlier generations and interoperability through conformance to the FiRa standard. This permits UWB connections to other vendors' FiRa-compatible chipsets and UWB-equipped mobile phones, such as the latest generation Apple, Google and Samsung devices.
The module is a fully integrated device, needing only power to produce a fully functioning UWB and BLE node, with both antennas incorporated into the module. Measuring only 12mm x 12mm x 1.5mm, this is a unique solution on the market in terms of its miniature size and level of integration. Ultra-low power can be achieved by using a combination of Bluetooth and the integrated accelerometer to switch on the UWB transceiver only when necessary.
The device supplies a wide range of peripherals, allowing a comprehensive choice of digital and analogue connections, including UWB, SPI, UART, I2C, programmable general purpose I/Os and onboard analogue to digital converters.
Nick Wood, sales and marketing director for Insight SiP, said, "We are delighted to launch this module with the next generation of UWB technology. With the FiRa standard gaining wide acceptance and the implementation of UWB on mobile phones, we believe ultra-wideband has truly 'come of age' and will become an increasingly prevalent technology."
Applications for the new device comprise secure entry, real-time location systems, ticketing and barrier control, and hands-free key solutions.