29-07-2024 | Elma Electronics | Test & Measurement
Elma Electronic offers a 3U VPX MORA-ready Development Platform (MRDP) that is pre-integrated with interoperable components and software for faster RF system development. Standard configuration includes various PICs from open standards industry partners and a comprehensive set of software implementation tools from partner Sciens Innovations.
Travis Doll, PhD, president and CEO at Sciens Innovations, noted: "The collaborative environment fostered by the open standards community is truly the catalyst to our industry's continued advancements. By integrating best-of-breed technologies with solid partnerships and shared technical know-how, we are bringing better solutions to market faster and with less risk."
The company's new MRDP leverages Sciens' helix Core MORA RF tools to provide turn-key functionality out of the box. This enables the user to instantly view, evaluate, and control MORA resources to explore device capabilities and functionality, as well as create, view, and modify MORA Signal Resource Profiles (MSRPs). The MRDP also provides a known reference platform to support system development. The pre-integrated environment within the MRDP simplifies the process of creating RF signal processing capabilities and expedites integrating existing applications within the MORA space.
Ken Grob, director of embedded technologies for Elma Electronic, added, "In keeping with the principles of the MOSA mandate, Elma's new MRDP provides a customized, fully integrated MORA-ready system that leverages a wide set of proven ecosystem products aligned to SOSA and CMOSS. System designers can configure applications more rapidly in a development environment, and then easily migrate the completed system to a deployable platform as well. This is the rapid technology acceleration our industry needs."
Developed by the U.S. Department of Defense (DoD), MORA is designed to provide modularity, openness, and scalability in an open architecture. It enables system integrators and manufacturers to reduce costs, increase innovation, and accelerate application development while addressing the challenges of rapidly evolving and increasingly complex RF systems.