MOSFETs and a new sensor highlight strength in intelligent power and sensing

onsemi will present and demo the company's latest innovations at electronica 2022. Visitors to its booth will see cutting-edge demos covering the automotive, industrial and Cloud power markets. This includes applications in EVs, advanced safety, factory automation, energy infrastructure and EV charging – many of them based on SiC. The company controls its end-to-end SiC supply chain – from volume boule growth to best-in-class integrated modules and discrete package solutions, giving customers the supply assurance they value.

One essential demo will offer innovative top-side cooling MOSFETs created to simplify thermal design in challenging applications such as motor control and DC-DC conversion. Housed in an LFPAK package measuring only 5mm x 7mm, the seven new devices feature a 15mm2 thermal pad that lets heat dissipate directly into a heatsink rather than through the PCB. This results in lower PCB temperatures, thereby increasing overall system reliability and lifetime. The new concept allows a simplified thermal design and system-level cost savings.

There will also be a new rotary position sensor based on its patented dual-inductive technology. This new approach means that the NCS32100 provides a combination of accuracy (+/-50 arcsec), speed (up to 45,000RPM) and price (sub-$10). Unlike other solutions, it is simple to employ with an integrated M0+ MCU and firmware that greatly decreases design time and the necessity for external components, permitting compact designs to be achieved.

The highlight of the booth will be the Mercedes-Benz VISION EQXX. Visitors will learn more about the collaboration between the carmaker and onsemi – including how the EV drove 1,202km (747 miles) from Germany to the UK on a single charge, enabled by the company's SiC technology!

electronica 2022, booth 101, hall C4.