Panel-to-board/busbar interconnects for blind mating applications

Mouser now ships the PowerWize BMI high-current panel-to-board/busbar interconnects from Molex. Dense electronic packaging often demands designs where subassemblies are mated with no visual guidance. These interconnects provide engineers with high-current carrying capacity and accurate mating in hard-to-reach and visually obscured applications like data centre power transmission systems, base stations, battery management inverters and electric vehicle charging stations.

The connectors include the company's COEUR socket technology, where panel-mounted receptacle housing's guideposts align with the inner surfaces of the header sidewalls before contacts and pins engage to allow trouble-free blind mating. These conical sockets also supply low contact resistance and low voltage drop, creating minimal heat generation at the contact interface, resulting in higher current-carrying capacity than other contact designs. These headers and receptacles are also designed to satisfy industry-standard, safe-to-touch needs.

The interconnects provide screw-mount pins attached to PCBs or busbars with solder tail pins to enhance manufacturing flexibility in three different sizes: 3.4mm (75A), 6mm (110A) and 8mm (175A). Cable assemblies feature ±2.00 mm of radial self-alignment to mitigate stack-up tolerance issues. At the same time, the reflow-capable/wave solder-capable solder tail headers are ideal for either pin-in-paste reflow PCB processing or wave solder PCB processing. These crimp machined contacts provide a wide range and accept 1/0, 2, 4, 6, 8, or 10 AWG wires.