Solder preform technology enables lower processing temperatures

Indium Corporation introduces a novel alloy technology for lower processing temperatures in preform soldering. Specifically created for power module package-attach applications, Indalloy301-LT is a bismuth-free alloy that stops thermal defects in the module without sacrificing reliability, such as traditional bismuth-containing low-temperature alloys.

Available in InFORMS configurations, the product delivers a solution for consistent bondline thickness and enhanced strength to improve thermal and mechanical reliability of the solder joint while decreasing processing temperature and energy input during manufacturing. This allows complementary Pb-free high-reliability alloy technologies such as Indalloy276 to be used in power module die-attach, component-attach or interconnects without the risk of re-melt and degraded performance. The product is also obtainable in preforms and ribbon configurations and can be supplied flux-free or with Indium Corporation’s flux coating technology.

“With increasing mission profile demands in power electronics applications, such as EV power module-cooler integration, preform soldering offers superior thermal and mechanical performance compared to traditional thermal interface materials,” said product manager Joe Hertline. “By leveraging this new alloy technology in package-attach applications, designers can prevent warpage, encapsulation breakdown and delamination issues by reducing processing temperature, making preform soldering a viable approach with robust thermal and mechanical reliability performance.”

The product will be introduced at Productronica 2023, November 14-17.