Backplane interconnect system delivers 40Gbps performance

Mouser is now stocking the Impel Backplane Interconnect System from Molex. Delivering industry-leading low cross-talk and high-density performance for next-generation backplane interconnect solutions, the system offers a migration path for enhancements in the same chassis through Impel daughtercard options, providing data rates as fast as 40Gbps. This enables developers to migrate to faster data rates without a redesign while meeting industry mechanical density requirements. The Molex Impel Backplane Interconnect System, available from Mouser Electronics, provides a scalable price-for-performance solution, enabling high-speed data rates from 25 to 40Gbps using compact backplane and daughtercard connectors. The Impel conventional connector orientation, with a right angle daughtercard mating to a vertical header, provides 3 to 6 pair options to support optimal price and performance. The 1.90mm conventional solution supports 80 differential pairs per linear inch. In this same configuration, the Impel connector system enables co-planar solutions, which supports right angle daughtercard mating to right angle headers for added scalability. For orthogonal architectures, the Impel backplane connector system allows for 3 to 6 pair configurations, scaling from 18 to 72 differential pairs per node. The skew-less design of Molex's Impel Backplane Interconnect System includes a staggered header-pin interface for robust mechanical isolation from the signal pins. All connectors provide end-to-end channel performance, with compliance in both the Optical Internetworking Forum (OIF) Stat Eye and IEEE 10GBASE KR. Molex's Impel Backplane Interconnect System are ideal for a variety of aerospace and defence, data communications, industrial, telecommunications and data networking applications, says the company.