Low-profile direct-solder terminals for space-constrained applications

TTI now stocks Molex's low-profile SolderRight direct-solder terminals in Europe. Enabling secure and reliable connections at a low applied cost, the robust solder terminals have specifically been designed for applications where a very low profile right angle solder option for wires exiting a PCB is necessary due to severe space constraints. In addition to a very low profile of only 1.95mm, the SolderRight one-piece crimp solder terminal includes unique design features such as multiple terminal and wire sizes, solder pins positioned between insulation and conductor crimps, and twin solder pins. Terminal wire sizes range from 14 to 28 AWG, enabling both signal and power current capability while optimizing PCB space. Solder pins positioned between insulation and conductor crimps offer superior wire strain relief and resist terminal and solder join breakage. Twin solder pins provide stability for solder processing and allow redundant current paths, says the company.