Tiny Bluetooth Smart module is particularly suitable for wearable devices
12-05-2015 |
Farnell element14
|
Subs & Systems
The ultra-compact TDK SESUB-PAN-T2541 Bluetooth Smart low energy module,
with a miniature footprint of just 4.6mm x 5.6mm and slim insertion height
of 1mm, is believed by the manufacturer to be the world's smallest module
for such a device.
Now available from Farnell element14, the device's compact size makes it
particularly suitable for wearable devices, a market that has already seen a
rapid rise in consumer interest in recent times and is expected to
accelerate in the near future.
The new module is based on TDK's proprietary SESUB technology (semiconductor
embedded in substrate). The Bluetooth IC die is embedded into the thin
substrate, while all the peripheral circuitry, including a quartz resonator,
bandpass filter and capacitors, is integrated on top.
This design enables the new Bluetooth low energy module to be nearly 65%
smaller than modules using discrete components. The new module thus assists
the hardware design process and allows easy implementation of Bluetooth
connectivity simply by connecting it to a power supply and antenna.
The Bluetooth 4.0 LE specification is intended to reduce the power
consumption of battery powered wireless devices significantly. The
SESUB-PAN-T2541 Bluetooth 4.0 LE module cuts power consumption to about one
quarter of that of classic Bluetooth devices, making it perfectly suited for
a wide range of wireless healthcare, sport, fitness, home entertainment and
wearable devices, where minimal size, weight and power consumption are
essential, says the company.