Ultra-compact 1Mbit SPI FRAM for power critical miniature applications

Fujitsu Semiconductor Europe (FSEU) has unveiled a new ultra-small package for its 1Mbit SPI FRAM device. The new 8-pin wafer level chip scale package (WL-CSP) is an additional package variant to the existing product MB85RS1MT. In comparison to the industry standard SOP-8 package, the new WL-CSP package, which measures 3.09mm x 2.28mm x 0.33mm, reduces the surface mounting area by 77%, and the device height by 80%. With this product release, Fujitsu is offering 1Mbit SPI FRAM product with the industry's smallest packaging technology. The WL-CSP package makes FRAM the ideal non-volatile memory solution for wearable and sensor applications. These fast expanding markets request ultra small device dimensions, extremely low power consumption for maximum battery lifetime, and high endurance in write cycles in case of real time logging. Exactly in these aspects, FRAM is delivering an excellent performance, says the company. While conventional non-volatile memories like EEPROM or Flash memory are covering an endurance of the range of only 1 million write cycles, the MB85RS1MT FRAM device provides an endurance of 10 trillion read/write cycles, allowing a flexible storage of real time logging data. In contrast to the block access of EEPROM and Flash, FRAM can be overwritten fast and flexibly into each memory cell without any waiting time. As a result, FRAM consumes much lower energy in the writing access, and contributes a great deal to extend the battery lifetime, especially for wearable / sensor applications with frequent logging functions. Finally the miniature 8pin WL-CSP package, which is only 5% of the mounting volume of SOP-8, allows the designers to realize more miniature applications. The MB85RS1MT device operates in the voltage range of 1.8V - 3.6V and 'guarantees' a data retention of 10 years at 85C. The operation temperature ranges from -40C to 85C.