Bluetooth Smart low-energy module measures just 4.6mm x 5.6mm

Ideal for wearable device applications, Farnell element14 now stocks TDK's ultra-compact SESUB-PAN-T2541 Bluetooth Smart low-energy module, with a miniature footprint of just 4.6mm x 5.6mm and slim insertion height of 1mm. The module is based on TDK's proprietary SESUB technology (semiconductor embedded in substrate). The Bluetooth IC die is embedded into the thin substrate, while all the peripheral circuitry, including a quartz resonator, bandpass filter and capacitors, is integrated on top. This design enables the new Bluetooth low energy module to be nearly 65% smaller than modules using discrete components. The new module thus assists the hardware design process and allows easy implementation of Bluetooth connectivity simply by connecting it to a power supply and antenna.