No mix, thermally conductive, electrically insulative epoxy for underfill applications

Master Bond’s EP3UF is a one component epoxy that contains thermally conductive fillers with very small particle sizes imparting a low thermal resistance. This low viscosity system has good flow properties and can be applied in bond lines as thin as 10-15 microns. It offers a thermal conductivity and a volume resistivity exceeding 1014ohm-cm. It also passes NASA low outgassing tests and can be used for bonding and underfills in microelectronics packaging/assembly applications. As a single component system, it is easy to handle with an ‘unlimited’ working life at room temperature and fast cures at temperatures as low as 250F. This high performance system delivers a tensile strength of 5,000-7,000psi and a compressive strength of 18,000-20,000psi. It bonds well to a variety of substrates such as metals, composites, ceramics, and many plastics. This dimensionally stable compound has low shrinkage upon curing. The epoxy withstands many chemicals, including water, cleaning solvents, oils and fuels. This light yellow colored epoxy is serviceable over the temperature range of -51C to +121C. It is available for use in 10cc syringes, 30cc syringes, half pint and pint containers and has a six month shelf life at room temperature in its original, unopened containers.