New IMP with CIP topology reduces costs with smaller footprints

Vincotech has launched a new, deeply integrated intelligent power module for 600V applications. The flowIPM 1B CIP 600V features the powerful combination of a high-speed F5 IGBT with the switching performance of a MOSFET and a silicon carbide boost diode in the PFC circuit optimised for frequencies up to 150kHz. The high-speed device, paired with the silicon carbide boost diode in the PFC circuit, not only delivers impressive performance, it also drives down the cost of external passive components. The current rating of this new CIP topology housed in an integrated power module is also impressive: 10A @ 80C heat sink temperature. The deeply integrated module enables manufacturers to slash their overall system's size, cost, and time to market. It also features an inverter gate drive with a bootstrap circuit for high-side power supply, as well as emitter shunts (30mohm) for vastly improved motion control. These modules come in 17mm flow 1B housings. Versions in the 12mm housing, with press-fit pins and with phase-change material are available on request.