Power integrated module for driving BLDC motors in automotive applications

Now in stock at Mouser, is the STK984-190-E Power Integrated Module (PIM) from ON Semiconductor. Optimized for driving three-phase brushless DC (BLDC) motors in automotive applications, the module’s seven MOSFETs are mounted onto a direct bonded copper (DBC) substrate, resulting in a compact module with excellent thermal performance taking up only half of the board space used by an equivalent discrete solution. The company’s module contains six AEC-Q101 qualified 40V, 30A MOSFETs configured as a three-phase bridge with an additional 40V, 30A high-side reverse battery protection MOSFET. The module’s DBC substrate reduces thermal resistance, which lowers the operating temperature of the MOSFETs and decreases power losses while increasing reliability due to a limited change in temperature during thermal cycling. Reliability is also improved by the isolation provided by the DBC substrate. Designers can combine the module with motor controllers to build high-efficiency BLDC solutions with best-in-class thermal performance, built-in diagnostics, and an ultra-small PCB that saves critical size and weight. The module is supported by the STK984-190-EGEVB evaluation board, and is suitable for use in 12V automotive electric motor drive applications with power ratings up to 300W, such as electric pumps, fans, and windscreen wipers.